EH 400 Gridless Ion Source - Ion Beam Scientific - The next generation end-hall gridless ion source from Kaufman & Robinson Inc.


	EH 400
		Technical Data
		Controller

	EH 1000

	EH 2000

The EH 400 is yet another successful ion source development from KRI, the originators and patentees of the Veeco-Commonwealth MKI & MKII ion sources.

The original gridless ion source technology is now some 20 years old. However, development continued and in recent times has lead to a radical redesign and improved ion source efficiency. A doubling of beam current and increase operational range is the result. High performance ion beams can now be simply and economically integrated in to most thin film deposition systems.

EH 400 Versions

EH 400F Filament Version
	The EH 400 being of physically compact design is ideally suited for smaller deposition systems or installation where system baseplate space restrictions apply. Its physical dimensions of only 9.4 cm dia. x 7.6 cm high disguise its powerful potential of of producing 875 mA of ion beam current over an ion energy range of 35 – 210 eV. A water-cooled front plate option is available for lower temperature applications.

EH 400HC (Filamentless) Version
	The EH 400HC is supplied with a hollow cathode electron source in place of a tungsten cathode filament. This allows extremely long operational times, lower process temperatures and promotes a high purity thin film environment. A water-cooled front plate is available as an option.

Typical Applications

The EH 400 is compatible with ion beam pre-cleaning and ion assist applications in small to medium sized deposition systems. Typical examples of suitable systems for installation would include:

Leybold L 560 Box Coater
Leybold CCS 250 Ophthalmic Coater
Satis MC 380 Ophthalmic Coater

Process Benefits

With its performance standards, the EH 400 allows the user to optimize a process recipe to achieve the desired film properties, resulting in proven film enhancements:

Increased film adhesion
Increased film density
Control of film stoichiometry
Higher index of refraction
Low film absorption and scatter
Smooth film interfaces
Hard film abrasion resistant films
Control of film stress
Substrate surface activation
Low temperature processing on temperature sensitive materials
Spectral film stability when exposed to moisture and temperature

Advantages

Optimized operation for different gases
- O2, Ar, N2, Hydrocarbons, Xe
Opened-up range of operation
- Ion energies, ion currents and process pressures
Increased reliability
- Rugged connectors and cables
- Field proven power modules and components
- Gas delivery system efficiently distributes gas and minimizes leaks
Easier and less expensive to maintain and use
- Modular anode
- Enhanced magnetic circuit
- Shielded and covered insulators and cables
- Smaller and weighs less
Designed for process flexibility and opportunity
- Interchangeable and optimized process modules
  - Flexible range of operation of ion beam properties
  - Opens-up new process windows for film applications
Operates from Mark I power supply
- Drop-in replacement
- Process and hardware compatible

Next > Technical Data